E-Beam, Electron Beam Evaporation, a thermal evaporation process, is a most common type of Physical Vapour Deposition (PVD) process. (Reference: Introduction of Physical Vapour Deposition and Thermal Evaporation VS…
Magnetron sputtering is one of physical vapor deposition (PVD) processes developed in the 1970s. The planar sputtering targets and rotary targets are the most common…
Sputtering targets can be divided into rotary targets and planar targets according to their shapes. Planar targets mainly refer to circular targets and rectangular targets…
Physical vapour deposition (PVD) is a thin-film coating process which produces coatings of pure metals, metallic alloys and ceramics, thickness usually in the range 1…
Thermal Evaporation Sputtering Deposition Rate Thousand atomic layers at a time (thickness control is difficult) One atomic layer at a time (thickness control is…
When working with a vacuum chamber and, specifically, a sputtering system, proper sputtering target handling is essential. Any residual buildup of grease, dust, and old…